MeetingMinutes2014012¶

Status meeting¶

High Level Software¶

This week:

• Spent lots of time on BOM simulation. Fully functional.

Next week:

• Do BOM behavior in simulation.

Mechanical Team¶

This week:

• Agreed on tasks
• Bottom and Top layer planned to be designed by 2 weeks and then 3d printed

Next week:

• Get things modelled

Low Level Software¶

This week:

• Successfully tested BOM circuit. It will work with new capacitors.

Next week:

• Finalize protocol over i2c so we can finalize BOM code.

Electrical Hardware¶

Last week:

• Tried to test the BOM, had the wrong capacitors.

Next week:

• Switching to Udoo for the main board! We'll design a sheild for it.