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Latest revisions

# Date Author Comment
cec2aa8e 11/07/2011 08:32 AM Abraham Levkoy

Fixed silkscreen ugliness in power board

Went through layout and changed ugly names and values to good ones.
Moved text off of vias and pads and out from under things. Deleted
giant, useless USB port and ISP header labels. Added description, date
of design, and attribution in corner.

7a4f167f 11/07/2011 07:39 AM Abraham Levkoy

Adjusted position of VUSB decoupling cap

b5b699df 11/07/2011 07:22 AM Abraham Levkoy

Increased widths of several high-current traces

Mostly GND around charging circuit and gas gauge

2951343e 11/07/2011 06:06 AM Abraham Levkoy

Decreased trace width between gas gauge resistors

Decreased width of trace between 49.9KOhm resistors in gas gauge voltage
divider to reduce noise.

d2b7d4f7 11/07/2011 06:02 AM Abraham Levkoy

Widened battery and charger traces

Widened to 20 mils some traces that come from the battery and charger
connectors, because they carry higher currents.

f01b49cf 11/07/2011 05:46 AM Abraham Levkoy

Added ground poly under charger IC

Added polygon under LT3650 IC and updated it to new device from kwoo
library. It now has effectively both a ground pad and a via. Slight area
of no contact right around via may be unavoidable.

38c9810d 11/07/2011 05:28 AM Abraham Levkoy

Widened traces, moved gas gauge power supply

Widened traces that carry VBATT. Lined up decoupling capacitors for LDOs
with their connected LDO ports. Rerouted various traces ripped up during
execution of previous changes.

6328aca1 11/07/2011 04:29 AM Abraham Levkoy

Rerouted decoupling caps and pullup around AVR

Rerouted decoupling capacitors and new pullup resistor around AVR to
increase trace width for power inputs and decrease unneccessary loops.

1637ab5d 11/07/2011 03:41 AM Abraham Levkoy

Fixed USB circuit problems

Routed USB_TX and USB_RX more directly. Put decoupling capacitors on FTDI
chips closer to the inputs they decouple.

0b2acc15 11/06/2011 08:06 PM Abraham Levkoy

Changed center ground pad for DS2786 and LT3650

Changed ground pads for packages 10MSOP and 12TDFN to have through-hole
pads on the bottom instead of SMD pads. Updated power test board to use
the new DS2786. Drew a polygon of BATT_GND around center pad. Not sure...

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