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Revision 0b2acc15


Added by Abraham Levkoy almost 3 years ago

Changed center ground pad for DS2786 and LT3650

Changed ground pads for packages 10MSOP and 12TDFN to have through-hole
pads on the bottom instead of SMD pads. Updated power test board to use
the new DS2786. Drew a polygon of BATT_GND around center pad. Not sure
if it is exactly the recommended pad size, but it didn't generate any
DRC errors. Did not try out the other package or update Scoutfly.


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